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Hopling Technologies selects Fujitsu for its next generation carrier-grade WiMAX end-to-end solution


• Hopling Technologies standardizes on Fujitsu’s innovative system-on-chip technology for its carrier-grade HopMAX™ product portfolio of base stations and high-end subscriber stations.
• Hopling Technologies HopMAX™ products offer a high-quality broadband wireless solution with unmatched functionality and automatic installation.
• Hopling Technologies uses Fujitsu’s innovative system-on-chip technology for its new WiMAX and mesh hybrid node; Xnet Mark-III mesh router and access point.
• Hopling Technologies incorporates its meshed network expertise to the delivery and integration of converged mobile solutions based on WiMAX Forum certified™ specifications.

WiMAX Focus - Radisson SAS Hotel Amsterdam Airport, September 8, 2005 - Hopling Technologies, a global leader in wireless networking equipment for enterprises, operators and service providers, announced today the integration of the MB87M3400 system-on-chip IC from Fujitsu Microelectronics Europe (FME), a leading provider of semiconductor products in Europe into Hopling Technologies core WiMAX development. Hopling Technologies has selected Fujitsu's system-on-chip as the standard silicon for its next generation HopMAX™ product portfolio of base station systems, micro base stations and high-end subscriber stations.

Based on the ratified IEEE 802.16-2004 specification, Hopling Technologies HopMAX™ product portfolio incorporates IP-rich systems functionality and the convergence of Hopling Technologies wireless mesh routing architecture enabling seamless metropolitan and event-based coverage, leveraging the advantages of WiMAX and WiFi such as mobility, high throughput, low cost, and the ubiquitous of client devices, enabling a host of exciting new applications and business models.

“Our partnership with Fujitsu Microelectronics Europe gives Hopling Technologies access to state-of-the-art chip technology”, said Ivo van Ling, Chief Technology Officer. “As we expand our product portfolio, we feel secure that Fujitsu’s innovative system-on-chip technology allows us to meet the rapidly changing business needs of our customers. This collaboration also provides assurance to Hopling Technologies’ customers that the broadband technology products they buy today offers future-grade functionality.”

Manfred Mettendorff, Senior Marketing Manager at Fujitsu Microelectronics Europe added, “In Europe in particular, we are experiencing a rapid implementation of WiMAX. Fujitsu’s cost efficient solution enables Hopling Technologies to offer competitive business models with fast return on investment.”

“Today's announcement marks an important step towards accelerating the delivery of ubiquitous broadband wireless computing and connectivity to more people than ever before,” said Frank Koopman, Chief Executive Officer of Hopling Technologies. “By launching the next generation HopMAX™ products, Hopling Technologies brings its meshed network expertise to the delivery and integration of converged WiMAX based solutions.'

The WiMAX and mesh hybrid Xnet Mark-III node and the next generation HopMAX™ products will become commercially available later in the year.

Hopling Technologies and Fujitsu plan ongoing, comprehensive support for the current and future WiMAX standards, as the WiMAX Forum™ and its member companies work to deliver IEEE 802.16e to serve mobile wireless broadband applications.


Publisher Contact Information:

Hopling Technologies B.V.
+31 36 548 6868
press@hopling.com

Company profile of Hopling Networks B.V.
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