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TPACK and Altera agree to jointly promote TPACK solutions worldwide


June 5: Copenhagen, Denmark: TPACK and Altera Corporation have entered into a joint marketing and sales agreement whereby Altera will assist TPACK in promotion of its 3rd Generation of packet mapper and switching technology on a global basis.

TPACK provides solutions for packet data switching and transport across Ethernet/MPLS and SONET/SDH networks. TPACK's 3rd Generation of solutions includes 10 Gbps NG-SONET/SDH packet mapper and 40 Gbps switching technology. TPACK solutions are based on Altera Field Programmable Gate Array (FPGA) devices where TPACK utilizes the inherent re-programmability of FPGAs to offer customized solutions to its customers.

As part of the agreement, Altera agrees to assist TPACK in promotion and sales support of 3rd Generation technology and solutions. This provides TPACK with access to a world-class sales and marketing organization, while at the same time providing telecom customers with powerful technology that takes full advantage of FPGA technology.

'Our relationship with TPACK demonstrates Altera's commitment to enabling sophisticated, high value customer solutions,' John Sakamoto, senior director of Altera's Wireline Business Unit. 'TPACK applies Altera's high-performance FPGAs in telecom applications enabling a rapid response to evolving market needs. They also employ Altera's seamless, risk-free HardCopy®™ structured ASIC for a dramatic, pin-compatible cost-reduction path.

'We are very excited about this business relationship, which we believe is a true win-win for both Altera and TPACK. TPACK receives the support of a strong global organization, while TPACK provides solutions that showcase the strengths of FPGA technology', according to Peter Viereck, CEO TPACK.

For more information, contact TPACK at http://www.tpack.com/contact

About TPACK
TPACK is a leading provider of linecard solutions for packet data transport and switching. This includes Ethernet/MPLS over NG-SONET/SDH and Carrier Class Ethernet solutions. TPACK solutions are based on Field Programmable Gate Array (FPGA) devices that allow rapid development and customization. This allows TPACK to meet customer specific needs without sacrificing time-to-market. TPACK's customer base includes Tier 1 MSPP providers who account for ca. 55% of the market. This includes over 40 design-in wins and over three years of field deployment for many solutions. TPACK is headquartered in Copenhagen, Denmark.


Publisher Contact Information:

TPACK A/S
+45 8870 1985
danjoe.barry@tpack.com

Company profile of TPACK A/S
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